The Era of Edge Computing: A Vast New Frontier, From "Cloud" to Edge
Edge Computing is bringing a new wave of computing and business opportunities.
In the era of data, data is the last thing we lack.
The "Data Age 2025" report released earlier by IDC points out that the global volume of data generated annually will grow from 33 Zettabytes (ZB) in 2018 to 175 ZB by 2025.
Processing such massive amounts of data requires computational power. Given the constraints of local computing power costs and other limitations, an increasing number of applications rely on cloud computing.
However, despite its power, cloud computing has its limitations:
1. Timeliness: Transmitting vast amounts of data over limited bandwidth resources can lead to network congestion, resulting in latency in data feedback.
2. Effectiveness of Computing Power: The lack of a data pre-processing stage means that raw data can lead to wasted computational resources in the cloud.
Today, the exponentially growing data collected by billions of IoT and mobile devices is driving a shift from sending data to the cloud for processing and storage towards a distributed model.
China Mobile Global Partner Conference 2023
Recently, XSPLink and Intel jointly presented at the "Computing Ignites a New Journey, Intelligence Shares the Future"-themed China Mobile Global Partner Conference 2023. They showcased their latest application achievements spanning from the network core to the edge.
A highlight was the Secure Edge Gateway, developed through collaboration between China Mobile's Chengdu Industrial Research Institute Branch and XSPLink， This solution leverages NetSec Acceleration Card technology.
This comprehensive edge security access and computing resource integration and management solution enables enterprise edge platforms to achieve:
Secure Cloud-Edge Collaboration & Access: Facilitating secure network and cloud access for edge nodes.
Powerful AI Inferencing Support: Providing robust computational power for AI applications at the edge.
Rapid Edge Cloud-Network Deployment: Accelerating the deployment of edge cloud and network capabilities.
Q3 2023 Intel & Chuangshi Xunlian Fall Workshop
Recently, Intel and XSPLink held a Fall Workshop on Edge Computing in Chengdu. The event invited leading vendors including Chengdu DBAPPSecurity (Anheng Information), Hangzhou DPTech, and Beijing Chaitin Future (Changting) to participate.
Edge computing is rapidly gaining traction. However, as workloads are continuously pushed closer to data source points, this trend imposes critical requirements on edge solutions: They must fully exploit usage patterns at the network edge to deliver advantages like low latency and reduced backhaul bandwidth costs. Crucially, they must also meet stringent power and space constraints while simultaneously delivering high performance and robust security.
Intel Empowers XSPLink to Build Scalable Solutions for Multi-Scenario Applications, Powering Edge Intelligence Through Hardware-Software Integration
"Reduce Costs, Enhance Efficiency: Ultimately, all problems technology solves boil down to these four words. This is a universal demand across all scenarios and industries. The defining characteristic of edge computing is delivering services closer to end-users at the network edge.
This architectural approach meets critical industry requirements for digital transformation: agile connectivity, real-time operations, data optimization, application intelligence, and security & privacy protection.
Leveraging years of technical expertise and industry experience, XSPLink introduces its NR01/03 mid-to-high-end hardware security platforms, powered by the new generation of Intel® Xeon® D processors. Targeting cybersecurity, data security, and related fields, these platforms deliver exceptional performance, rich connectivity, high scalability, and high reliability to a broad range of industry users.
Hardware Advantages:
The Intel® Xeon® D-1700 and D-2700 processors are specifically engineered for compute-intensive workloads at the edge. They strike an optimal balance between high computational throughput and low Thermal Design Power (TDP).
They feature superior single-core performance, advanced security capabilities, and built-in hardware acceleration for encryption, AI, and compression workloads.This enables them to meet demanding workload requirements within density-optimized platforms.
Furthermore, the platform drives intelligent applications through the convergence of hardware, software, and AI algorithms.
High Scalability & Broad Application Value:
Benefiting from its high scalability, the XSPLink NR01/03 cybersecurity platform can be deployed across multiple scenarios, offering extensive application value. It delivers breakthrough, density-optimized performance, scalability, and value for:Network Security,5G Topologies,Edge Computing
Numerous other scenarios like networks, storage, Industrial IoT (IIoT), and the data center edge – enabled by Intel® Xeon® D processors with integrated Ethernet and edge accelerators.
Robust Security & Reliability Features: Comprehensive Monitoring & Control: Monitors motherboard voltage, battery voltage, dual power supply PMBUS, CPU core supply current, temperatures, and fan speeds.
Enhanced System Protection:
Independent hardware dual power supply failure alarm indicators.
Hardware CPU watchdog timer.
Powerful Fault Diagnosis: Automatic detection of motherboard or CPU faults.Memory error alerts. BIOS boot failure code indication.
Increased Hardware Reliability: Utilizes dual-contact memory slots for more robust electrical connections.
"Amidst the wave of industrial digitization, the importance of Edge Intelligence is becoming increasingly prominent. Drawing on years of accumulated experience, Chuangshi Xunlian is driving focused, sustained exploration into the edge computing industry, making intelligent edge a reality."